Equipamento de moldagem de semicondutores
(25)
Equipamento de processamento de semicondutores de resfriamento por água Sistema de moldagem semicônica Alta pressão
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Water Cooling Semiconductor Processing Equipment, Water Cooling Semicon Molding System, High Pressure Semiconductor Processing Equipment
Semicon Molding System Product Detail: Product Name: Semiconductor Molding Equipment Energy Consumption: Low Control System: PLC Application: Semiconductor Industry Molding Method: Injection Molding Capacity: High Plasticizing Press Plasticizing Press Plasticizing Press PLC Control System ● The auto... Veja mais
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1000 toneladas Equipamento de moldagem de semicondutores Dispositivo de vedação de plástico Alta precisão
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:1000 Tons Semiconductor Molding Equipment, Semiconductor Molding Equipment High Precision, semiconductor molding machine High Precision
Automatic Semiconductor Plastic seal Device FAQ: Q: What is the brand name of this product? A: The brand name of this product is TJIN. Q: What is the model number of this product? A: The model number of this product is 002. Q: Where is this product manufactured? A: This product is manufactured in Ch... Veja mais
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Equipamento de moldagem de semicondutores totalmente automático
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Fully Automatic Semiconductor Molding Equipment, Fully Automatic Semiconductor Molding machine
Fully Automatic Transfer Molding' Features ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansio... Veja mais
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Equipamento de embalagem de semicondutores de elevada eficiência
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Highly efficient Semiconductor Packaging Equipment, Highly efficient ic packaging Equipment
Semiconductor Packaging Equipment Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Veja mais
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Sistema de encapsulamento automático de chips
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Auto Chip Encapsulation System, Auto Chip encapsulation equipment
Auto Chip Encapsulation System Packing and Shipping: Packaging and Shipping for Semiconductor Molding Equipment Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our customers. Each unit is packed in a sturdy wooden crate with foam padding to protect against any da... Veja mais
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Equipamento de fabricação de semicondutores
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Chip Transfer Molding semiconductor manufacturing equipment, Chip Transfer Molding semiconductor manufacturing machine, Semiconductor Manufacturing Equipment Water Cooling
Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology and features to ensure effici... Veja mais
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Equipamento de moldagem de semicondutores confiável Operar sem problemas Controlado por PLC
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Reliable Semiconductor Molding Equipment, Reliable semiconductor molding machine, PLC Controlled Semiconductor Molding Equipment
TJIN Semiconductor Molding Equipment Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art tec... Veja mais
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Equipamento de embalagem de semicondutores de alta produtividade Dispositivo de moldagem de chips
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:High Productivity Semiconductor Packaging Equipment, High Productivity Chip Molding Device
Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; Semiconductor plastic seal... Veja mais
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Equipamento de moldagem de semicondutores de poupança de energia
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Energy Saving Semiconductor Molding Equipment, Energy Saving semiconductor molding machine, Semicon Transfer Molding Equipment
Auto Semicon Transfer Molding Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology... Veja mais
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Indústria de semicondutores equipamento de embalagem de IC sistema de moldagem de chips automatizado
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Semiconductor Industry IC Packaging Equipment, Semiconductor Industry Chip Molding System, IC Packaging Equipment Automated
Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one -stop automatic packaging test. Product Description: Semiconductor Molding Equipment Th... Veja mais
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Equipamento de moldagem de semicondutores de alta eficiência Sistema de moldagem de chips 50/60Hz
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:High Efficient Semiconductor Molding Equipment, High Efficient Chip Molding System, Semiconductor Molding Equipment 60Hz
Semiconductor Chip Molding System 【Features】 ● Semiconductor packaging equipment is also known as chip packaging equipment and IC packaging equipment, semiconductor MOLDING packaging equipment; ● Automatic packaging test chip, semiconductor device, IC and other products; ● Full servo control system,... Veja mais
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Máquina de moldagem de semicondutores de injecção única
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Single Injection semiconductor molding machine, Single Injection semiconductor fab equipment, Semiconductor Molding Machine Fully Automatic
Fully Automatic Transfer Molding 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; ● Full servo ... Veja mais
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Equipamento de produção de semicondutores totalmente automático para moldagem por injecção
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Full Auto Semiconductor Production Equipment, Injection Molding Semiconductor Production Equipment, Injection Molding semiconductor fab equipment
Automatic Molding System Product Description: Semiconductor Molding Equipment Our Semiconductor Molding Equipment is designed specifically for the semiconductor industry and offers a fully automatic molding system with advanced control capabilities. With our state-of-the-art PLC control system, our ... Veja mais
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Equipamento de moldagem de semicondutores de 90KW Dispositivo de moldagem de transferência de semicondutores
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:90KW Semiconductor Molding Equipment, Semicon Transfer Molding Device, 90KW semiconductor molding machine
Semicon Transfer Molding 【Performance parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm in length, 0.15-1.2mm thick; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length/diameter ... Veja mais
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Equipamento de moldagem de semicondutores de alta produtividade
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:High Productivity Semiconductor Molding Equipment, High Productivity Chip Molding System, Chip Molding Semiconductor Molding Equipment
Auto Chip Molding System Technical Parameters: Parameter Value Maintenance Easy Control System PLC Application Semiconductor Industry Capacity High Cycle Time Short Safety Features Advanced Molding Method Injection Molding Precision High Energy Consumption Low Pressure Control Precision Pressure Con... Veja mais
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Equipamento de moldagem de semicondutores eléctricos Sistema de encapsulamento de semicondutores
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Semiconductor Molding Equipment Semicon Encapsulation, Electric Powered Semiconductor Molding Equipment, Electric Powered semiconductor molding machine
Auto Semicon Encapsulation System Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Veja mais
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Sistema de encapsulamento de chips Equipamento de fabricação de semicondutores Eficiência energética
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Chip Encapsulation semiconductor fab equipment, Semiconductor Fab Equipment Energy Efficient, Chip Encapsulation System Energy Efficient
Auto Chip Encapsulation System Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Veja mais
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Máquinas de fabricação de chapas de semicondutores de prensas de plastificação automática certificadas ISO9001
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Auto Plasticizing Press Chip Manufacturing Machines, ISO9001 Semiconductor Chip Manufacturing Machines, ISO9001 chip manufacturing equipment
Auto Plasticizing Press Machine Product Detail: ● Full servo control system, PLC (Omron)+upper machine; ● Win10+15 -inch touch screen+touch keyboard; ● CCD image detection, feed anti -counter -anti -detection ● Standardized mold structure, convenient replacement; ● High -efficient ingredients, cakes... Veja mais
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Equipamento de moldagem de semicondutores de pressão de plastificação de chips 380V 50Hz
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:Chip Plasticizing Press Semiconductor Molding Equipment, Chip Plasticizing Press semiconductor molding machine, Semiconductor Molding Equipment 380V
Chip Plasticizing Press Customization: TJIN Semiconductor Molding Equipment Customized Service Brand Name: TJIN Model Number: 002 Place of Origin: China Precision: High Capacity: High Maintenance: Easy Control System: PLC Safety Features: Advanced Our company, TJIN, specializes in providing customiz... Veja mais
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Máquinas de fabricação de semicondutores de alta automação
Preço: Negotiable
MOQ: 1 set
Prazo de entrega: 40 days
Marca: TJIN
Realçar:highly Automation semiconductor fabrication machines, highly Automation Semicon Molding Equipment
Auto Semicon Molding Equipment Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Veja mais
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