Máquina de ligação IC
(6)
Máquina de ligação IC
Preço: Negotiable
MOQ: ≥1 pc
Prazo de entrega: 25~50 days
Marca: Suneast
Realçar:combined selective multi module wave solder, wave soldering multi module combined selective, combined multi module wave solder selective
IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC... Veja mais
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Máquina de ligação de circuitos integrados de camadas múltiplas 0,25*0,25mm-10*10mm Equipamento de ligação por embolamento
Preço: Negotiable
MOQ: ≥1 pc
Prazo de entrega: 25~50 days
Marca: Suneast
Realçar:soldering combined multi module wave selective, selective multi module combined wave soldering, combined wave soldering selective multi module
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image p... Veja mais
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Máquina de ligação de alta precisão IC 8-12 polegadas Wafers Die Bonders
Preço: Negotiable
MOQ: ≥1 pc
Prazo de entrega: 25~50 days
Marca: Suneast
Realçar:combined wave soldering multi module selective, magnetic spring motor ce iso, iso ce magnetic spring motor
Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic ... Veja mais
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Máquina de ligação a borracha de mudança rápida IC Supermini Chip Bonding Machine
Preço: Negotiable
MOQ: ≥1 pc
Prazo de entrega: 25~50 days
Marca: Suneast
Realçar:wave soldering selective combined multi module, multi module combined wave soldering selective, multi module wave soldering selective combined
Supermini Chip Placement Quick Changeover IC Bonder CBD2200 Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips. Featu... Veja mais
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Máquina de ligação de circuito integrado de pequena dimensão de alta velocidade Máquina de ligação de plataforma modular Die Bonder
Preço: Negotiable
MOQ: ≥1 pc
Prazo de entrega: 25~50 days
Marca: Suneast
Realçar:spring motor ce iso magnetic, motor iso magnetic spring ce, selective wave solder multi module combined
Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types of chip placement High flexibility to suppor... Veja mais
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Sinterização Die Bonder SDB 200
Preço: Negotiable
MOQ: ≥1 pc
Prazo de entrega: 25~50 days
Marca: Suneast
Realçar:selective multi module combined wave solder, wave solder combined selective multi module, selective wave solder combined multi module
Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achievin... Veja mais
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