Chip de embalagem a nível do painel

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China Dimensão do painel 310*320mm Chip MOS fino Sílice Baixo consumo de energia à venda

Dimensão do painel 310*320mm Chip MOS fino Sílice Baixo consumo de energia

Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Veja mais
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China Chip de LED de silício LED controlador de corrente constante Chip 0.4mm * 0.555mm * 0.20mm à venda

Chip de LED de silício LED controlador de corrente constante Chip 0.4mm * 0.555mm * 0.20mm

Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps. Specifications: Chip size 0.... Veja mais
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China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistência Chip ((Silicone) à venda

310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistência Chip ((Silicone)

Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: Chip size: 0.76*0.61; 1.43 * 1.06; Package size: 2.76*1.97; 2.58 * 2.92; Package thickness: 360um; Process introduction: After the chip is reconstructed to the temporary carrier board, the pick and placement is performed and later plastic compressive molding, followed by grinding, laser... Veja mais
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China Embalagens de nível de painel de ventilador de 310*320 mm (FOPLP) IC Chip ((Silicone) à venda

Embalagens de nível de painel de ventilador de 310*320 mm (FOPLP) IC Chip ((Silicone)

Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: Panel size:310*320mm; Package size: 12*18*0.9mm; Package thickness: 0.9mm; Brief introduction to the process: After the temporary carrier board is attached, plastic sealing and chip reconstruction are done, the first layer of RDL is made, followed by etching +ABF pressing + laser drilli... Veja mais
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