Estrutura do produto de embalagem a nível de painel
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Embalagem em nível de painel face para baixo EWLB Alta dissipação de calor Alta confiabilidade
Preço: Negotiable
MOQ: Negotiable
Prazo de entrega: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Veja mais
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Embalagens de nível de painel de ventilação (FOPLP) - Estrutura do produto (face para cima)
Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX Fan-Out Panel Level Packaging
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surf... Veja mais
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Embalagens de nível de painel de ventilação (FOPLP) - Estrutura do produto (face para cima) - Esfera de ligação de fio
Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and... Veja mais
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Embalagem de nível de painel de ventilação (FOPLP) Estrutura do produto Embalagem incorporada
Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX
Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ; 2,While maintaining the original foot position design, it is much thinner an... Veja mais
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