Experimentos de simulação de embalagens
(1)
Embalagem adequada para vários experimentos de simulação de embalagem
Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Veja mais
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