Carcaça do pacote de FCCSP
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Material de BT da espessura da carcaça 0.3mm do pacote verde de PBGA/CSP para o conjunto de IC
Preço: US 85-100 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Green CSP package substrate, BT CSP package substrate, BT PBGA package substrate
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electroni... Veja mais
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Fabricação da carcaça de FCCSP que apoia China
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Gold Plating Soldermask Antenna PCB, 0.1mm Antenna PCB, 0.1mm 4 Layer PCB
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,O... Veja mais
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Tipos ENEPIG do acúmulo da carcaça 4L do pacote de FCCSP
Preço: US 85-100 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.2mm Antenna Circuit Board, Intelligent Handwriting Antenna Circuit Board, Large 0.2mm Antenna PCB
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Veja mais
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semiconductor FCCSP Package Substrate manufacture
Preço: US 85-100 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Necl... Veja mais
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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
Preço: US 85-100 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:ENEPIG FCCSP package substrate, Buildup Types FCCSP package substrate, 0.3mm FCCSP substrate
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Veja mais
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
Preço: US 85-100 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Green Color FCCSP Package Substrate, Flip Chip FCCSP Package Substrate, BT FCCSP Substrate
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts st... Veja mais
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Apoio da produção da carcaça do pacote de FCCSP
Preço: US 85-100 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... Veja mais
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Apoio da produção da carcaça do pacote de Flip Chip CSP
Preço: US 85-100 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF... Veja mais
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