Carcaça de BGA
(27)
Camada ENEPIG de BT FR4 NAND Memory Substrate Board 35/35um 4
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... Veja mais
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PWB da carcaça do pacote de IC do eMMC
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB
For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC as... Veja mais
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Os tipos de Anylayer/acúmulo sorvem a fabricação de empacotamento da carcaça
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Horexs PCB, Gold Plated RAM PCB, 0.8mm RAM PCB Board
Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mai... Veja mais
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Material de BT da espessura da carcaça 0.3mm do pacote verde de PBGA/CSP para o conjunto de IC
Preço: US 85-100 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Green CSP package substrate, BT CSP package substrate, BT PBGA package substrate
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electroni... Veja mais
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Fabricação da carcaça dos sensores de semicondutor
Preço: US 0.1-0.12 each piece
MOQ: 1000pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Fingerprint Recognition PCB Board Fabrication, UL Fingerprint Recognition PCB, Fingerprint Recognition PCB For Intelligent Lock
Application:Fingerprint recognition electronics,IoT electronics,Semiconductors ,Semiconductor,IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki... Veja mais
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Ouro macio material do controle 4L BT da impedância da carcaça do módulo do RF
Preço: US 0.089-0.109 each piece
MOQ: 1000pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Goldfinger Fingerprint Recognition PCB, FR4 Fingerprint Recognition PCB, 0.15mm Fingerprint Recognition PCB
Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) Finished thickness:0.21mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; S... Veja mais
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Chapeamento feito sob encomenda do dedo do ouro do PWB de Rohs do teste padrão do alto densidade
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Rohs Pcb Gold Finger Plating, High Density Pattern Pcb Gold Finger, Custom Pcb Gold Finger Plating
Description Of IC Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish signal connections between IC and PCB, in addition to protecting circuits, fixing lines, and dissipating residual heat. Application: NAND memory Flash... Veja mais
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Fabricação Multilayer da carcaça da carcaça do material MEMS/CMOS do ODM BT do OEM
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:OEM MEMS PCB, ODM MEMS PCB, BT Multilayer Circuit Board
Ultrathin MEMS PCB use OhmegaPly Cooper Foil and Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) fini... Veja mais
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Produção da carcaça do pacote de BGA/QFN para o semicondutor da indústria de IoT
Preço: US 0.1-0.12 each piece
MOQ: 1000pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:4 Layer Camera Module PCB, Horexs Camera Module PCB, Horexs 4 Layer PCB
Application:Smart electronics,Smart healthy electronics,Smart agricultural electronics,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuis... Veja mais
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Placa de circuito livre de ligamento do PWB do halogênio do ODM 0.15mm do OEM
Preço: US 95-120 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Halogen Free PCB Circuit Board, ODM PCB Circuit Board, Bonding Halogen Free PCB
Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4... Veja mais
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A solda lisa resiste a placa de circuito impresso 0.4mm eletrônica de superfície
Preço: US 0.089-0.109 each piece
MOQ: 1000pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.4mm Electronic Printed Circuit Board, Smooth Solder Resist Printed Circuit Board, 0.4mm Printed Circuit Board
Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package S... Veja mais
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fabricação do PWB da eletrônica dos cuidados médicos/eletrônica da Micro-audição
Preço: US 85-120 each square meter
MOQ: 10 squre meters
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.2mm Medical Equipment PCB, Highly Intensive Medical Equipment PCB, 0.2mm Routed Circuit Board
Application:healthy electronics,Microelectronics devices,others; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Othe... Veja mais
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