Carcaça do pacote de IC

(47)
China PWB da carcaça do pacote de IC do eMMC à venda

PWB da carcaça do pacote de IC do eMMC

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB
For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC as... Veja mais
➤ Visita Local na rede Internet
China carcaça do pacote de 25um BGA FBGA para o empacotamento da memória CI à venda

carcaça do pacote de 25um BGA FBGA para o empacotamento da memória CI

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:25um FCBGA Package Substrate, BGA FCBGA Package Substrate, Automotive FCBGA Memory Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Veja mais
➤ Visita Local na rede Internet
China Apoio da produção da carcaça do pacote de Hitachi BT IC à venda

Apoio da produção da carcaça do pacote de Hitachi BT IC

Preço: US 0.11-0.13 each piece
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:BT IC Package Substrate, FR4 Printed Circuit Board Pcb, FR4 IC Package Substrate
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semicondu... Veja mais
➤ Visita Local na rede Internet
China carcaça do pacote de conjunto de 0.15mm IC para o pacote do semicondutor à venda

carcaça do pacote de conjunto de 0.15mm IC para o pacote do semicondutor

Preço: US 0.1-0.12 each piece
MOQ: 1000pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.15mm Ultrathin Pcb, Ultrathin Pcb Printed Circuit Board Assembly, 0.15mm Printed Circuit Board Assembly
Application:IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF... Veja mais
➤ Visita Local na rede Internet
China Fabricação da carcaça do pacote de AUS308 PSR IC à venda

Fabricação da carcaça do pacote de AUS308 PSR IC

Preço: US 0.086-0.1 each piece
MOQ: 1000pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Black Solder mask Pasted Fr4 Board, Black Fr4 Board BAG Bonding, Solder mask Pasted Fr4 Board
Application:UDP memory card,TF card,Memory card,SD card ,IC substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:... Veja mais
➤ Visita Local na rede Internet
China espessura de 0.15mm 2 de IC camadas da carcaça do pacote para o pacote da memória à venda

espessura de 0.15mm 2 de IC camadas da carcaça do pacote para o pacote da memória

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.15mm Thickness IC Package Substrate, 2 Layers IC Package Substrate, FR4 Substrate Printed Circuit Board
Memory Card PCB Produce by MEIKI Vacuum Laminator Direct use for Capsulation Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.o... Veja mais
➤ Visita Local na rede Internet
China Camada de empacotamento da carcaça 1-6 do semicondutor FR4 FBGA IC à venda

Camada de empacotamento da carcaça 1-6 do semicondutor FR4 FBGA IC

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:FBGA IC Packaging Substrate, FR4 IC Packaging Substrate, FBGA Semiconductor Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Veja mais
➤ Visita Local na rede Internet
China PWB da carcaça do pacote de IC do armazenamento à venda

PWB da carcaça do pacote de IC do armazenamento

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Storage IC Package Substrate Pcb, Horexs IC Package Substrate Pcb, IC Package Substrate Horexs
Storage IC package substrate pcb For Storage IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC packa... Veja mais
➤ Visita Local na rede Internet
China PWB da carcaça do pacote da RDA IC à venda

PWB da carcaça do pacote da RDA IC

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:DDR IC Package Substrate Pcb, DDR IC Package Substrate, DDR IC Pcb
DDR4/LPDDR,BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Suitable for cell phone,Ipad,Set top box,Wearable electronics ,UAV. Application:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC sub... Veja mais
➤ Visita Local na rede Internet
China Fabricação material da carcaça de BT do tipo de Hitachi à venda

Fabricação material da carcaça de BT do tipo de Hitachi

Preço: US 0.1-0.12 each piece
MOQ: 1000pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:IC Package Substrate Printed Circuit Board, Horexs IC Package Substrate, Complex Substrate Printed Circuit Board
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semicondu... Veja mais
➤ Visita Local na rede Internet
China Fabricação de empacotamento da carcaça da precisão 0.15mm IC à venda

Fabricação de empacotamento da carcaça da precisão 0.15mm IC

Preço: US 0.1-0.12 each piece
MOQ: 1000pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.15mm IC Package Substrate, 0.15mm Flexible Pcb Fabrication, IC Package Substrate Flexible Pcb Fabrication
Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF... Veja mais
➤ Visita Local na rede Internet
China Fabricação padrão da carcaça do pacote de IC do eMCP de JEDEC à venda

Fabricação padrão da carcaça do pacote de IC do eMCP de JEDEC

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:eMCP IC Package Substrate, eMCP Pcb Board Fabrication, UL Pcb Board Fabrication
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; S... Veja mais
➤ Visita Local na rede Internet
China 0.2mm fabricação da carcaça do cartão de memória de 2 camadas para Capsulation à venda

0.2mm fabricação da carcaça do cartão de memória de 2 camadas para Capsulation

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.2mm Pcb Board Fabrication, Pcb Board Fabrication For Capsulation, 2 Layer Memory Card Pcb
Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Min... Veja mais
➤ Visita Local na rede Internet
China Carcaça do pacote do semicondutor CI de HOREXS com Chip Wire Bonding à venda

Carcaça do pacote do semicondutor CI de HOREXS com Chip Wire Bonding

Preço: Depend on customized spec.
MOQ: Sample or Mass production
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Horexs Bga Circuit Board, Ultra Thin Bga Circuit Board, Bga Circuit Board With Wire Bonding
Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ... Veja mais
➤ Visita Local na rede Internet
China Carcaça do pacote de BGA IC com material chapeado tampão de MGC BT à venda

Carcaça do pacote de BGA IC com material chapeado tampão de MGC BT

Preço: Depend on customized spec.
MOQ: Sample or Mass production
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:BGA IC Package Substrate, IC Package Substrate With Cap Plated, Horexs Printed Circuit Board
Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainl... Veja mais
➤ Visita Local na rede Internet
China Carcaça do pacote de IC da ligação do ouro do ODM do OEM 4 camadas à venda

Carcaça do pacote de IC da ligação do ouro do ODM do OEM 4 camadas

Preço: Depend on customized spec.
MOQ: Sample or Mass production
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:IC Package Substrate PCB 4 Layer, ODM IC Package Substrate, OEM IC Package Substrate
Application:IC substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/wi... Veja mais
➤ Visita Local na rede Internet
China a acumulação 4L datilografa a 0.8mm o ouro a carcaça de superfície do pacote de IC à venda

a acumulação 4L datilografa a 0.8mm o ouro a carcaça de superfície do pacote de IC

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Horexs IC Package Substrate 0.8mm, Gold Surface Multilayer Pcb Board, 0.8mm IC Package Substrate
Application:Dram memory electronics,IC card,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finishe... Veja mais
➤ Visita Local na rede Internet
China Fabricação Multilayer brilhante da carcaça do ouro 0.2mm com AUS308 PSR à venda

Fabricação Multilayer brilhante da carcaça do ouro 0.2mm com AUS308 PSR

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Bright Gold 0.2mm Multilayer Pcb, Horexs Multilayer Pcb, Bright Gold 0.2mm Multilayer Pcb Fabrication
Application: Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.... Veja mais
➤ Visita Local na rede Internet
China PWB ultra fino da camada FR4 do cartão de memória multi para a capsulagem à venda

PWB ultra fino da camada FR4 do cartão de memória multi para a capsulagem

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Horexs FR4 Pcb, Ultra Thin FR4 Pcb For Encapsulation, Memory Card Ultra Thin FR4 Pcb
Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENG... Veja mais
➤ Visita Local na rede Internet
China pacote de empacotamento do semicondutor da carcaça do sorvo material de 4layer BT à venda

pacote de empacotamento do semicondutor da carcaça do sorvo material de 4layer BT

Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:MSAP Sip Packaging Substrate, BT Sip Packaging Substrate, 4layer CSP Semiconductor Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Veja mais
➤ Visita Local na rede Internet