...
>
Carcaça de BGA
(27)
Camada ENEPIG de BT FR4 NAND Memory Substrate Board 35/35um 4
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... Veja mais
➤ Visita Local na rede Internet
1-6 carcaça da camada FR4 BGA para o chip de memória da GOLE de FCBGA
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:FR4 BGA Substrate, DRAM Memory Chip BGA Substrate, FCBGA Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material... Veja mais
➤ Visita Local na rede Internet
Fabricação da carcaça do pacote de MicroLED/MiniLED
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Fine Pitch Micro Pcb Board, Micro Pcb Board No Chromatism, Fine Pitch Pcb For Outdoor Led
Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... Veja mais
➤ Visita Local na rede Internet
Tomada completa da resina da carcaça do pacote da espessura BGA de Horexs 0.2mm todos os furos e chapeamento do tampão
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.2mm Mini PCB Board, Horexs LED PCB Board, Horexs Mini PCB Board
Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsui... Veja mais
➤ Visita Local na rede Internet
Carcaça material L/S 35/35um de Pacakge do semicondutor de BT
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:BT FR4 BOC Pacakge Substrate, Improved Tenting BOC Pacakge Substrate, BOC Pacakge fr4 substrate
BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width 1mil (20um) Finished thickness BT (0.1-0.4mm) finished thickness Mainly brand SHENGYI... Veja mais
➤ Visita Local na rede Internet
Pacote de BGA da carcaça da memória com superfície macia do ouro de ENEPIG ENIG
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:MicroSD BGA Substrate, TF Memory BGA Substrate, ENEPIG BGA Substrate
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you send inquiry us,Pls be know that we have to get the following : 1-substrate production sepc. information; 2-Gerber files(substrate designer/engineer ca... Veja mais
➤ Visita Local na rede Internet
Fabricação da carcaça do módulo de RF/Wireless/5G IC
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:BT Pcb Printed Circuit Board, 2 Layer Pcb Printed Circuit Board, BT Black Pcb Circuit Board
Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-... Veja mais
➤ Visita Local na rede Internet
fabricação da carcaça do pacote da microeletrônica
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Black Soldermask LED PCB Board, Black Soldermask led lamp pcb, LED PCB Board With total Pad
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPl... Veja mais
➤ Visita Local na rede Internet
eletrônica da placa do PWB do luminoso do teclado da espessura de 0.2mm
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:0.2mm Backlight Pcb, Keyboard Backlight Pcb, 0.2mm keyboard pcb board
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... Veja mais
➤ Visita Local na rede Internet
Placa Ultrathin do PWB do diodo emissor de luz do ODM 0.2mm do OEM para o teclado
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:ODM Ultrathin LED PCB Board, OEM 0.2mm LED PCB Board, 0.2mm PCB Board For Keyboard
Application:LED keyboards electronics,consumer electronics,telecom.electronics;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsu... Veja mais
➤ Visita Local na rede Internet
0.25mm terminou a placa de circuito Fr4 impresso sem chumbo
Preço: US 1.3-1.1 each piece
MOQ: 100pieces
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Lead Free Fr4 Printed Circuit Board, 0.25mm Fr4 Printed Circuit Board, 0.25mm Lead Free Circuit Board
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... Veja mais
➤ Visita Local na rede Internet
Carcaça terminada de superfície BT FR4 do furo BGA de ENEPIG meia
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Half Hole BGA Substrate, ENEPIG BGA Substrate, BT FR4 Package Substrate
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubi... Veja mais
➤ Visita Local na rede Internet
BGA empacotam 0.29mm núcleo de Flip Chip Substrate BT de 4 camadas
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:4 Layer Flip Chip Substrate, BGA Package Chip Substrate, BT Core FCBGA Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickn... Veja mais
➤ Visita Local na rede Internet
35um linha empacotamento da memória da GOLE da placa da carcaça de BT FR4
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:BT FR4 Substrate Board, 35um Line Substrate Board, DRAM Memory Packaging FR4 Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.15mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-F... Veja mais
➤ Visita Local na rede Internet
Placa de empacotamento da carcaça de IC da carcaça da ligação BGA do fio de ENIG
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Wire Bond BGA Substrate, ENIG BGA Substrate, IC Packaging Substrate Board
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; M... Veja mais
➤ Visita Local na rede Internet
O MCP Chip Substrate Board Fabrication BT ENIG 0.25mm terminou a espessura
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:MCP Chip Substrate Board Fabrication, BT ENIG Substrate Board Fabrication, 0.25mm Finished BGA Package Substrate
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finish... Veja mais
➤ Visita Local na rede Internet
A carcaça ENEPIG da camada CSP de BT FR4 4 melhorou Tenting
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:BT FR4 CSP Substrate, 4 Layer CSP Substrate, ENEPIG BGA Package Substrate
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly bran... Veja mais
➤ Visita Local na rede Internet
Ouro macio de ligamento do ouro duro do UL ENIG da carcaça do fio de L/S 30um BT
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:BT Wire Bonding Substrate, 35um Line Wire Bonding Substrate, UL ENIG IC Package Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohme... Veja mais
➤ Visita Local na rede Internet
BT ENEPIG 4 espessura terminada da carcaça do pacote do sorvo da camada 0.24mm
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:4 Layer Sip Package Substrate, BT ENEPIG Sip Package Substrate, 0.29mm Finished Package Chip Substrate
Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Sur... Veja mais
➤ Visita Local na rede Internet
O cobre da carcaça 0.5oz do pacote do MCP personaliza o material de BT
Preço: US 120-150 per square meter
MOQ: 1 square meter
Prazo de entrega: 7-10 working days
Marca: Horexs
Realçar:Immersion Gold FR4 Substrate, 0.5oz Copper MCP Substrate, MCP FR4 Substrate
MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei provinc... Veja mais
➤ Visita Local na rede Internet