310*320mm Tamanho do painel Nível do painel QFN Baixa resistência elétrica
Preço: Negotiable
MOQ: Negotiable
Prazo de entrega: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Veja mais
➤ Visita Local na rede Internet
Dimensão do painel 310*320mm Chip MOS fino Sílice Baixo consumo de energia
Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Veja mais
➤ Visita Local na rede Internet
Embalagem em nível de painel face para baixo EWLB Alta dissipação de calor Alta confiabilidade
Preço: Negotiable
MOQ: Negotiable
Prazo de entrega: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Veja mais
➤ Visita Local na rede Internet
310*320 mm Embalagens de nível de painel de ventilação (FOPLP) GaN Produto
Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Veja mais
➤ Visita Local na rede Internet
Alta relação de aspecto TGV Capacidades de fundição para embalagens de semicondutores
Preço: Negotiable
MOQ: 10 panel
Prazo de entrega: 1 month
Marca: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... Veja mais
➤ Visita Local na rede Internet
Embalagem adequada para vários experimentos de simulação de embalagem
Preço: Negotiable
MOQ: 3000pcs
Prazo de entrega: 1 month
Marca: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Veja mais
➤ Visita Local na rede Internet